What is difference between 2D IC and 3D IC - Answers.com 2D and 3D refer to the actual dimensions in a computer's workspace. 2D is 'flat', using the X & Y (horizontal and vertical) ...
硅穿孔- 维基百科，自由的百科全书 TSV 是一種讓3D IC封裝遵循摩爾定律（Moore's Law）的互連技術，TSV可堆疊多片晶片， ... 取自“http://zh.wikipedia.org/w/index.php?title=硅穿孔&oldid=31244086”.
Three-dimensional integrated circuit - Wikipedia, the free ... 跳到 3D ICs vs. 3D packaging - [edit]. 3D packaging saves space by stacking separate chips in a single package. This packaging, known as System in ...
Through-silicon via - Wikipedia, the free encyclopedia 跳到 TSV technology in 3D ICs - [edit]. A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and ...
Integrated circuit - Wikipedia, the free encyclopedia 跳到 ULSI, WSI, SOC and 3D-IC - This section does not cite any references or sources. Please help improve this section by adding citations to ...
Three-Dimensional Integrated Circuit Wiki ( 3D IC ) - SemiWiki A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally ...
3D-Integration – Wikipedia 跳到 Unterschied von 3D-ICs und 3D-Packaging - [Bearbeiten]. Beispiel für die 3D-Integration von einem Hauptchip und drei Nebenchips.
跳脫SoC思維3D IC須要「異」樣眼光- 趨勢眺望- 新通訊元件雜誌 3D IC的問世因能為摩爾定律解套，進而吸引了不少業界的目光。 .... Arrhenius equation, Wikipedia, Available at: http://en.wikipedia.org/wiki/Arrhenius_equation, ...
